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Molding

What Is Molding?

Moldings

Molding refers to the process of pouring melted resin into a metal mold or applying pressure to a powder to form it. Injection molding is a common method of manufacturing plastics, and injection molding equipment is available from various companies. A molding technology is also used in the manufacturing process of semiconductors to protect semiconductor chips, making it an indispensable technology in today’s industry.

Uses of Moldings

Moldings are used in a variety of industries, including plastic manufacturing sites, semiconductor manufacturing sites, and resin product manufacturing sites. Protective coatings on plastic bottles and semiconductor chips are the main destinations for moldings. When selecting equipment for molding, it is necessary to consider manufacturing speed, molding accuracy, power consumption, and the materials of molding that are supported. Especially for molding equipment used in the manufacturing process of precision equipment, its components, and semiconductors, it is necessary to select high-precision equipment.

Principles of Moldings

The following is an explanation of the principle of operation of moldings, using injection moldings of plastic and semiconductor moldings as examples, which are the main applications of moldings.

  • Injection Molding
    Injection molding is used to mold plastic bottles and plastic containers. The resin melted by heating is poured into a mold, which is then cooled to form the resin into the shape of the mold. For general continuous injection moldings, there is a device that removes the mold from the die, allowing for continuous moldings.
  • Semiconductor moldings
    Semiconductor moldings are performed to protect semiconductor chips from oxidation and dust adhesion by surrounding them with resin after the wiring has been completed. A mold is placed over the semiconductor chip, and a small amount of melted resin is poured into the mold and allowed to cool before molding. The resin must be poured at a temperature that does not damage the semiconductor, and solidified in a high-precision mold so that no burrs or other defects are generated.

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