What Is a Reflow Oven?
A reflow oven is a heating device used in the production of printed circuit boards (PCBs), bonding electronic components to boards using solder.
Operating typically at temperatures between 150°C and 230°C, the reflow oven’s temperature range may vary depending on whether the solder contains lead.
Uses of Reflow Ovens
Reflow ovens are crucial in bonding electronic components to PCBs in unit board production. They are particularly advantageous when soldering a large number of components or those with small bonding surfaces. The precision of reflow ovens becomes essential as components get smaller and more densely packed, avoiding issues like weak adhesion or short circuits often encountered in manual soldering.
Principles of Reflow Ovens
The reflow oven heats up by blowing hot air inside, with the temperature increased by directing hot air perpendicularly onto the board. When the solder, placed on the board, melts due to the heat, electronic components positioned on the solder adhere to the board. After soldering, the oven cools down, solidifying the solder and securing the components to the board.
Other Reflow Oven Information
1. Difference Between Flow Oven and Reflow Oven
A flow oven, used for flow soldering, involves boards passing over a bath of molten solder, requiring a solder bath and resulting in larger equipment. In contrast, a reflow oven utilizes paste solder or cream solder, applied to the board or component, which forms a metallic bond when heated in the oven, eliminating the need for a solder bath.
2. Filling the Reflow Oven with N2 Gas
Filling the reflow oven with nitrogen gas (N2) can reduce the oxygen concentration, preventing oxidation of the rosin in the solder paste. However, this can sometimes lead to the soldering appearing cleaner than its actual quality, potentially passing inspection even if the bonding is insufficient. Decisions regarding the use of nitrogen gas should involve consultation with manufacturing, design departments, or contractors.