What Is a Vacuum Chuck?
Vacuum chucks are used for inspection equipment and dicing saws, with the function of adsorbing the object to be measured or processed.
The table surface can hold thin silicon wafers and other materials in a flat state by utilizing negative pressure and a porous structure.
When used in dicing saws, silicon wafers are cut in widths of 10 to 20 micrometers, so the silicon wafer suction surface must be parallel and flat.
Vacuum chucks excel in holding thin wafers without damage or deformation.
Uses of Vacuum Chucks
When used in semiconductor manufacturing equipment, vacuum chucks are mainly divided into four types according to their applications. All four types have the potential to contribute to the fields of measurement and inspection equipment.
- Adhesive tables are used for dicing saws, grinders, polishers, etc.
- Heater tables are used for bonding machines
- Spinner tables are used for dicing saws, resist coating equipment, etc.
- Plunge stages are used for die bonding machines, etc.
Principle of Vacuum Chucks
Porous materials include stainless steel grain and alumina ceramic, and body materials include titanium, stainless steel, and aluminum. These materials are used with vacuum chucks according to the application.
Ceramic porous is made of hardened alumina ceramic, and metal porous is made of hardened stainless steel powder. These materials can be produced in a variety of thicknesses to suit the application.
Ceramic porous can be colored. Darker colors such as dark blue, brown, and black are used. The darker color prevents stains from being detected and prevents reflections caused by shining light on the workpiece, ensuring a clearer image.
The general type consists of a metal body and a ceramic porous body. A groove is provided on the porous surface on the opposite side that receives the workpiece, so that negative pressure is drawn from the center of the body by placing the workpiece on it and spreading over the entire porous surface.
The porous surface has a groove on the opposite side that receives the workpiece, so that negative pressure is applied to the workpiece through the porous. If the grain of the porous is coarse, the surface of the workpiece will be uneven. The finer the grain of the porous will create a higher degree of flatness.