What Is a Substrate Cutting Machine?
Substrate Cutting Machine is a machine used to divide and cut substrates that are essential for manufacturing electronic devices.
There are two main types: router type and dry slicer type. The router type can process substrates and slits using a router attached to a high-speed spindle motor. It is capable of precision processing and has the advantage of being able to handle substrates of various shapes.
On the other hand, the dry slicer type is characterized by its ability to achieve a clean cut surface with straight cutting and no load. The finish after cutting is considered to be extremely beautiful. Various types of Substrate Cutting Machines exist, depending on the V-groove or perforation on the surface.
Substrate Cutting Machines, also called Board Dividers, play a very important role in the electronics manufacturing industry. By selecting the appropriate cutting method, product quality can be improved and production can be made more efficient.
Applications of Substrate Cutting Machines
Substrate Cutting Machines are used in electronics manufacturing to cut substrates into designed shapes. There are types that cut by rotating tools such as drills, routers, and slicers at high speed, and types that cut using lasers.
There are also manual types that are directly operated by the operator, and types with an automatic tool change function that automatically changes tools according to settings, allowing selection of the type best suited to the application and the efficiency of the work. Substrate Cutting Machines are used in a wide range of applications in the electronics manufacturing industry due to their diverse functions and range of applications.
For example, Substrate Cutting Machines play an important role in everything from general consumer electronics such as smartphones and PCs to electronic control systems in automobiles and aircraft, as well as in space development and medical equipment.
Principle of Substrate Cutting Machine
Substrate Cutting Machines are used in electronics manufacturing to separate multiple substrates arranged on the same sheet. They enable low-load cutting operations and prevent cracks and other damage, thereby improving work efficiency.
There are two typical principles of Substrate Cutting Machines: Router Splitting and Laser Method.
1. Router Cutting
Router cutting utilizes the high-speed rotation of a motor to move the cutting tool at high speed, enabling division without placing a load on the board. It enables precise processing and can be used for boards of various shapes.
2. Laser Method
The laser method enables non-contact cutting with a small load and no chips, making it possible to handle a wide variety of shapes using CAD data, etc. The laser method is also highly accurate. The laser method is also suitable for mass production due to its high accuracy and repeatability.
Other Information on Substrate Cutting Machine
Substrate Cutting Machine used in conjunction with a Substrate Cutting Machine
Substrate Cutting Machines are mainly used in conjunction with Board Drilling Machines, Board Screening Machines, SMT (Surface Mount Technology) equipment, Reflow Soldering Machines, and Wave Soldering Machines. Each machine works together to produce efficient and high quality products.
1. Board Drilling Machine
Board drilling machines are used to drill holes in circuit boards. It is capable of precisely drilling holes for attaching electronic components and for connecting circuits.
2. Board Screening Machine
Substrate screening machines are used to form printed circuits on substrates. They are responsible for printing patterns using ink to enable electrical connections.
3. Surface Mount Technology (Smt) Equipment
SMT equipment is a machine used to mount electronic components on boards using surface mount technology. It has high component mounting accuracy and contributes to improved production efficiency.
4. Reflow Soldering Machine
Reflow soldering machines are used to fix the connection between components and circuits mounted on boards by melting solder in the process of heating and cooling it to adhere to the connection.
5. Wave Soldering Machine
Wave soldering machines are used in the soldering process, which uses solder to secure the connection between components and circuits on the board. Wave soldering machines are especially applicable for through-hole mounted components.
By passing the board over a wave of molten solder, the lead terminals of the component and the pads on the board are connected by solder.