What Is a BGA Socket?
A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA) type, where lattice-shaped pins in a grid are inserted into a socket, BGA package boards are typically mounted by direct soldering. BGA sockets allow these boards to be mounted without soldering, making them easily removable.
Uses of BGA Sockets
BGA sockets are primarily used in the development of BGA-type package boards. They facilitate testing during development by enabling easy insertion and removal of the boards, a task that is difficult with directly soldered BGA-type package boards. BGA sockets and their adapters also assist in pin conversion and emulator connections.
Principle of BGA Socket
The back of a BGA socket has pins arranged in the same layout as on the board, and the socket is secured directly to the board’s mounting surface using screws or other methods, such as pogo pins, ensuring stable contact. The top surface of the socket mirrors this pin arrangement, and closing the top cover applies pressure to the package board for a firm connection. Frequent insertion and removal of the package board during testing can wear down the pins, so these are designed to enhance contact stability and prolong their lifespan.