What Is a Probe Card?
A probe card is an instrument required for wafer-level inspection in the semiconductor manufacturing process.
They are used by attaching them to wafer inspection equipment. Most of the cost of semiconductors is determined by the manufacturing equipment, but the cost of the package itself and packaging also has a large impact during the manufacturing stage. Therefore, it is possible to reduce costs by determining whether a product is good or bad at the wafer level after the semiconductor manufacturing process is complete, and sending only the good products to subsequent processes.
A wafer consists of several hundred to several thousand chips on a single wafer, and wafer inspection is the process of sorting these chips by determining whether they are good or bad before cutting them into individual pieces and packaging them.
Use of Probe Cards
Wafer inspection consists of an LSI tester that inputs electrical signals called test patterns to a chip and determines the output signal pattern by comparing it with expected values, a wafer prober that performs chip-level positioning control to connect signals accurately to the electrode terminals of each chip, and a probe card that performs positioning control to hit hundreds to tens of thousands of electrode terminals accurately, within a chip. Probe Cards with an equal number of needles (probes) positioned to precisely hit the hundreds of thousands of electrode terminals on the chip are used.
Probe cards must be made specifically for each chip design, which is costly in itself and requires re-creation due to wear from use, but is essential to overall manufacturing costs. Semiconductor chips are used in countless products, not only in computers, but in almost every product in our lives, and probe cards are one of the supports of these products.
Probe Card Principle
A probe card is mounted on the wafer prober and acts as a connector between the electrode terminals of the chip and the LSI tester through the wafer prober.
The LSI test head has spilling contact pins and high-density pins mounted for connection, but the placement pitch of the electrode terminals of a semiconductor chip is narrower than the pin placement density of the test head, at several tens of microns, so it is necessary to connect the two through the probe card.
Probe Card Structure
The upper side of the probe card has the connection pins to the test head, and the lower side has the needles to connect with the electrode pins of the semiconductor chip.
By connecting the test head and the probe card’s connection terminal, and then connecting the semiconductor chip’s electrode terminal and the probe card’s needle, an electrical connection is formed, and each semiconductor chip on the silicon wafer is tested by judging whether it is good or bad based on electrical signals from the LSI tester.
Probe cards are available in advanced and cantilever types. In the advanced type, a block with vertical terminals is attached to the board, and the probes can be freely arranged for easy maintenance. In the cantilever type, probes are directly attached to the board without any blocks, which makes it easy to accommodate narrow-pitch terminals.
Other Information on Probe Cards
Probe cards are often made of ceramic substrates, due to the fine and high level of reliability required in wafer inspection. For example, Kyocera uses thin-film single-layer and thin-film multilayer ceramic substrates with metallization for probe cards for DRAM, flash memory, and logic devices.
Generally, spring connectors or high-density connectors are used for the signal connections of large-scale integrated semiconductor circuits called LSIs or system LSIs. Probe cards also serve as an intermediary between the test head and the wafer to be inspected, and since they are required to have a high level of connection reliability and electrical inspection performance functions, their mechanisms and materials are delicate. Materials, such as ceramics are used.
However, the durability of probe cards is limited, and even the slightest distortion due to physical shock will prevent them from fulfilling their intended use. They are also consumable parts that are difficult to repair and must be replaced on a regular basis.