What Is Dicing?
Dicing is a precision process used in semiconductor manufacturing, typically following the photolithography stage. It involves cutting individual chips from a wafer, each containing its own set of operations and processes. This method is characterized by high precision cutting techniques and is crucial in the production of semiconductor devices.
A wafer can contain tens of thousands of chips, each separated by scribe lines. Dicing is performed along these lines using specialized equipment, such as a dicer or a laser dicer. The process requires high precision, typically along scribe lines of about 100μm or less. Common dicing methods include mechanical dicing with a thin circular blade (dicing saw) and laser dicing using thermal stress.
While primarily used for semiconductor wafers, dicing is also applicable to other electronic components like MEMS, ceramics, and glass, often provided as a contracted service due to the precision required.
Uses of Dicing
Dicing is essential in semiconductor manufacturing to separate individual chips from wafers. It is applicable to various wafer materials with different mechanical characteristics, including silicon, silicon carbide, and gallium nitride.
The process is also used in precision electronic components like MEMS, LEDs, and sensors. In broader applications, dicing is employed in industries such as packaging, automotive components manufacturing, and textiles for cutting materials into specific shapes and sizes.
Principles of Dicing
Dicing semiconductor wafers requires high processing precision, focusing on cut line accuracy and chipping width. Dicing devices include dicers and laser dicers, each offering distinct advantages in precision and process.
1. Dicer
Dicers use an ultra-thin circular blade to cut through the wafer, often employing diamond-tipped blades for precision. They are known for their high-speed cutting capability and may use pure water during the process.
2. Laser Dicer
Laser dicers utilize laser technology for cutting, including ablation processing and the Stealth Dicing™ process. This method is advantageous for its dry process and reduced environmental impact.
How to Choose Dicing
Companies may either conduct dicing in-house or outsource it. In-house dicing requires selecting suitable equipment based on processing precision, quality, speed, and cost. For outsourcing, considerations include compatibility with the material, processing method, quality control, delivery time, and pricing.