What Is a Board Processing Machine?
A board processing machine is a device that creates a circuit board by depicting a circuit pattern on a base on which a copper plate, the original of the board, is stretched. Board processing machines are equipped with a set of processing software. The software processes the board by loading the drawings to be processed on the board into the software. There are two types of substrate processing methods: the cutting method, in which substrates are made by cutting a copper plate covered base, and the photosensitive method, in which substrates are made by exposure and etching.
Uses of Board Processing Machines
Board processing machines are used to create circuit boards. They are used by companies that specialize in the creation of substrates, by factories that produce substrates for use in their products, and by laboratories that need immediate access to substrates. When selecting a board processing machine, it is necessary to consider the accuracy of wiring and other processing, the widths supported, the materials, and the size of the boards that can be processed. Attention should also be paid to the equipment used to remove cutting debris and the equipment used to dispose of waste fluid used in etching and other processes.
Principle of Board Processing Machines
The operating principles of board processing machines are explained separately for the cutting type and the photosensitive type.
- Cutting Type
A cutting type board processing machine consists of a stage for fixing the board, a cutting machine, and a cleaner for removing the cut dust. During operation, the machine obtains processing information on the board from the software and processes the board by cutting the board based on the information. Debris generated by cutting is inhaled by the cleaner and removed. Some products have a built-in deburrer to remove burrs and other debris generated during cutting. - Photosensitive Type
Photosensitive board processing machines consist of a stage for fixing the substrate, a light source, a photomask, and an etching container. During processing, light from the light source is irradiated onto the substrate base, which is coated with a photosensitive material, passing through a photomask that depicts the drawing in advance. The area shaded by the photomask remains unchanged by the photosensitive material. Subsequently, etching removes the light-sensitized areas, and by removing the light-sensitive material, wiring is created. The processing speed is faster than that of the cutting type and is suitable for mass production.