What Is a Pin Grid Array?
A pin grid array (PGA) is a packaging technology for integrated circuits (ICs), specifically designed to encapsulate high-functionality ICs.
PGAs function by using conductive adhesive to bond the IC chip to a substrate, with numerous pins protruding from the bottom for connection. These pins are crucial for facilitating all electrical interactions, encompassing signal transmission, power supply, and grounding. This type of package is prevalent in an array of applications, including computing, telecommunications, domestic appliances, and industrial equipment, due to its versatility and performance.
Distinguished by its high thermal dissipation capabilities, reliability, and ability to accommodate a large number of pins, PGAs offer significant advantages in implementing complex and high-performance ICs. Variants of PGAs include plastic pin grid array (PPGA) for cost-efficiency, ceramic pin grid array (CPGA) for enhanced thermal and mechanical properties, and land grid array (LGA) which differs by having pins on the socket instead of the package, facilitating higher pin densities.