Tosetz Plating Tools for Wafer/Substrate (株式会社東設) のカタログ情報
Tosetz Plating Tools for Wafer/Substrate
製品個別カタログ
カタログ紹介
Introduction to Tosetz' Plating Equipment
◆ Product Types
- Fully automatic face-up wafer plating equipment
- Fully automatic face-down wafer plating equipment
- Semi-automatic dip-type wafer/substrate plating equipment
- Tabletop plating equipment for research and development/prototyping
◆ Features
- Four types of plating cells
- Thickness uniformity within ±2%
- Compatibility with magnetic plating compositions
- Installed in HDD companies nationwide
- Customizable design
- Available for demo evaluation
◆ Applications
- Advanced semiconductor packaging for electronic components, sensors, magnetic heads, 3D/chiplets, etc.
- 4-inch to 12-inch wafers, rectangle substrates
◆ Process Types
- Copper wiring, electrodes (TSV, trench, RDL, Cu pillars, etc.)
- Nickel electroforming, gold bumps
- Lead-free solder (Sn, SnAg, etc.)
- Magnetic materials (NiCo, NiFe, NiCoFe)
◆ For more details, please download our catalog or feel free to contact us.
◆ Product Types
- Fully automatic face-up wafer plating equipment
- Fully automatic face-down wafer plating equipment
- Semi-automatic dip-type wafer/substrate plating equipment
- Tabletop plating equipment for research and development/prototyping
◆ Features
- Four types of plating cells
- Thickness uniformity within ±2%
- Compatibility with magnetic plating compositions
- Installed in HDD companies nationwide
- Customizable design
- Available for demo evaluation
◆ Applications
- Advanced semiconductor packaging for electronic components, sensors, magnetic heads, 3D/chiplets, etc.
- 4-inch to 12-inch wafers, rectangle substrates
◆ Process Types
- Copper wiring, electrodes (TSV, trench, RDL, Cu pillars, etc.)
- Nickel electroforming, gold bumps
- Lead-free solder (Sn, SnAg, etc.)
- Magnetic materials (NiCo, NiFe, NiCoFe)
◆ For more details, please download our catalog or feel free to contact us.
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